Tra-Con High Tg and Room Temperature Curing Fiber Optic Epoxy Adhesive

The item is packaged in a 2 gram rigid plastic tube separated by a leak-proof clamp (BIPAX). Remove the clamp and mix right inside the BIPAX. This eliminates mix ratio errors with pre-measured resin and catalyst components.This package will prepare approximately 25~30 connectors.

High Tg and Room Temperature Curing Fiber Optic Epoxy Adhesive

TRA-BOND F113SC is a room temperature curing, high Tg and low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors. It has also been used for bonding LED displays, lenses and other optical components.

TRA-BOND F113SC provides both high bond strength as well as low stress connections with no pistoning. This two part system can be cured overnight at room temperature or as quickly as 15 minutes at 90°C and is provided in a dark blue color to allow for easy polishing.

Properties

• Color, resin                                                                   Clear
• Color, hardener                                                           Dark Blue
• Color, mixed                                                                 Dark Blue
• Specific gravity, mixed                                               1.1
• Index of refraction                                                       1.52
• Viscosity, cps, mixed ((after mixing) @ 25°C)       1800
• Thixotropic index                                                        1
• Operating temperature range, °C                            -60/120
• Hardness, Shore D                                                    83
• Mix ratio, pbw, Resin/Hardener                               100/30
• Lap shear, alum to alum, psi (1 hour @ 65°C)     3900
• Lap shear, alum to alum, psi (24 hours @ 25°C)   2700
• Glass transition (Tg), °C, ultimate                            95
• Water absorption, %                                                   0.98
• VOC, grams/l                                                               1.91
• Coefficient of expansion, cm/cm/°C (above Tg)    0.000191
• Coefficient of expansion, cm/cm/°C (below Tg)    0.0000757

Cure Schedule

• 18 hours @ 25°C  or
• 1 hour @ 65°C  or
• 15 minutes @ 90°C for one drop applications 

Pot Life

• 35  minutes

Download MSDS from here.