( BAF110 ) Tra-Con Optically Transparent Low Viscosity Epoxy Adhesive -

The item is packaged in a 2 gram rigid plastic tube separated by a leak-proof clamp (BIPAX). Remove the clamp and mix right inside the BIPAX. This eliminates mix ratio errors with pre-measured resin and catalyst components.This package will prepare approximately 25~30 connectors.

BAF110 is a rigid, optically clear adhesive with a very low viscosity. This room temperature curing system is an excellent choice for thin bond-line assembly and repair applications of prisms, lenses and other optic components. Its high strength makes this epoxy ideal for structural applications and its insulative properties are perfect for intricate bonding of electronic components. BAF110 exhibits excellent wetting and wicking capabilities which allows it to adhere strongly to glass, ceramics, metals and most rigid plastics. Its highly structured matrix gives BAF110 good resistance to salt solutions, mild acids and alkalis and many other chemicals.

Cure Schedule:
24 hours @ 25°C or
1 - 2 hours @ 65°C

Pot Life:
25 grams, 6 minutes
100 grams, 1 hour

Properties:

Color: transparent, clear
Specific gravity, mixed: 1.17
Index of refraction: 1.54
Viscosity, mixed ((after mixing) @ 25°C): 300 cps
Thixotropic index: 1
Operating temperature range, °C: -60 ~ +130
Hardness, Shore D: 85
Mix ratio, pbw, Resin/Hardener: 100:11
Lap shear, alum to alum, 1 hour @ 65°C: 2600 psi
Lap shear, alum to alum, 24 hours at 25°C: 2150 psi
Lap shear, alum to alum, 4 hours @ 65°C: 300 psi
Glass transition (Tg), ultimate: 90°C
Water absorption, after 24 hours: 0.0004%
VOC: 39.1 grams/l
Spectral transmittance (320nm-900nm): 97%
Coefficient of expansion, cm/cm/°C: 0.00006
Impact, izod, ft. lbs/inch of notch: 0.24
Dielectric strength, volts/mil: 410
Dielectric constant (1 KHz @ 25°C): 4.3
Volume resistivity, ohm-cm @ 25°C: 60000000000000
Reactive solids contents: 100%

Download MSDS from here.