Loctite Hysol® 0151 Epoxy - Case of 10 sets -

Loctite® HYSOL® 0151 is a clear two-component epoxy having optical clarity when used in small quantities. Hysol 0151 is easy to mix and has a 30 minutes pot life. It is excellent for general connector use.

This item comes in a set of two separate tubes, each set weighs 3.3oz and 10 sets in a case. The price shown is for a case.

NOTE:
This item is considered hazardous material and GROUND shipment only. A UPS, FedEx or other carrier hazardous material handling fee will be added on each order.

Cure Schedule:
24 hours @25°C
2 hours @60°C
1 hour @85°C
30 mins @120°C

Pot Life:
100 grams, 60 minutes @25°C

Specifications:

Color: Milky White(Part A), Amber(Part B), Clear(Mixed)
Mix Ratio: 100(A):33(B) by weight, 2.7(A):1(B) by volume
Tg: 58°C
Elongation, ASTM D 638: 2.4%
CTE, ASTM D 696, in/in/ °C: 47x10e-6
Thermal Conductivity, cal x cm/cm2 x secs x °C: 5.6x10e-4
Shrinkage: <0.3%
Hardness, Shore D: 85
Dielectric Strength, ASTM D149, V/mil: 1080
Dielectric Constant, MIL 1-16923. K 1kHz: 3.88
Dissipation Factor, ASTM D 150 1kHz: 5.3x10e-4
Volume Resistivity, ASTM D 257 ohm/cm: 1.26x10e15
Recommended Substrates: glass, metals, circuit boards, fiber optics and many plastics

Recommended Substrates: Glass, Metals, Circuit Boards, Fiber Optics and many Plastics.

Features
Clear Color                               RT or Heat Cure                                Bonds Many Materials
Easy to Mix                              100% Solids                                       Thixotropic Paste
                             
Typical Properties        
                                                                  Part A                       Part B                     Mixed      
Color                                                         Milky White             Amber                    Clear   
Viscosity, Poise                                         400 - 1000                200 - 1000                 -
Specific Gravity @ 77°F                            1.13                          0.98                           -

Handling
Mixing:  This product requires mixing two components together just prior to application.  Complete mixing is necessary.  The temperature of the separate components prior to mixing is not critical, but they should be close to room temperature.
                                                                                               Part A                   Part B
By Weight                                                                              100                         33
By Volume  (cartridge 2:1-see note below)                          2.7                          1  
Pot Life @ 77°F, 100 grams                                                 60 minutes       

Application
Mixing :  Combine Part A (resin) and Part B (hardener) in the correct ratio and mix thoroughly until the color and consistency are uniform.  EPOXI-PATCH® Tube Kits have been designed so that squeezing EQUAL LENGTH BEADS of Part A  1 hour at 180°F; or 30 minutes at 250°F.  Heat cures can be modified to achieve a desired degree of cure from handling strength to full cure.

Mixing - Cartridges:  Place cartridge in proper dispenser.  To begin using a new cartridge, remove cartridge cap and dispense a small amount of adhesive, making sure both Parts A & B are extruding.  Attach nozzle and dispense approximately  1-2" before applying onto the part to be bonded.  Partially used cartridges can be stored with the mixing nozzle attached.  To reuse, remove and discard the old nozzle, attach the new nozzle, and begin dispensing.
**Note**Mix cartridge dispenses adhesive in a 2:1 ratio.  Tests show no significant effect on bond performance compared to 2.7:1 ratio.

Application: Bonding surfaces should be clean and dry. For optimum surface preparation, consult Dexter's Bulletin  Preparing the Surface for Adhesive Bonding.  Once the adhesive is applied, the bonded parts should be held in contact until the part has developed handling strength.  It is not necessary to clamp the parts unless movement during cure is likely.

Cure:  Complete cure is obtained after three days at room temperature.  After 24 hours, approximately 90% of full cure properties are attained. Hysol 0151 will achieve handling strength in 6-8 hours at 77°F (note: this can vary with different bond configurations).  Hysol 0151 can also be completely cured with heat such as:  2 hours at 140°F; 1 hour at 180°F; or 30 minutes at 250°F.  Heat cures can be modified to achieve a desired degree of cure from handling strength to full cure.

Clean Up:  It is important to remove excess adhesive from the work area and application equipment before it hardens. Many common solvents and citrus cleaners are suitable for removing uncured adhesive.  Consult with your supplier's information pertaining to the safe and proper use of solvents.

Performance
Tensile Lap Shear Strength: Tested on etched aluminum per ASTM D 1002.

Cure                                                 Test Temp.  °F            Typical Results, psi          
3 Days @ 77°F                                -67                                1600
                                                         77                                 1850
                                                         180                               400

2 Hours @ 140°F                           -67                                 2700
                                                         77                                 3000
                                                         180                               600

1 Hour @ 180°F                           -67                                  2700  
                                                       77                                   3000
                                                       180                                 500

Bulk Properties
Hardness (Shore D)                                                         85 Minimum @ 77°F
Glass Transition (Tg)                                                      136°F
Coefficient of Linear Thermal Expansion                     47 x 10-6/°C at 86° to 122°F per ASTM D696
Thermal Conductivity                                                      5.6 x 10-4 cal x cm/cm2 x sec x °C
Dielectric Strength                                                            1080 volts/mil, 5-18 mil film
Dielectric Constant                                                           3.88 at 77°F, 1 kHz
Volume Resistivity                                                          1.26 x 10+15 at 77°F, ohm/cm, 100V
Dissipation Factor                                                           5.3 x 10-4at 77°F, 1 kHz
Fungus Resistance                                                           Does Not Promote Fungus Growth per ASTM G-21
Elongation at Break                                                         2.4%
Linear Shrinkage                                                               less than .3%
Moisture Absorption                                                      less than .5% after 24 HR Immersion @ 77°F  

Download MSDS from here.