EPO-TEK® 353ND High-Temperature Heat Cure Epoxy (2.5g Packet)

EPO-TEK® 353ND is a premium two-component epoxy adhesive designed for high-reliability applications in fiber optics, photonics, semiconductor packaging, medical devices, and aerospace assemblies. Trusted throughout the industry, this heat-cure epoxy provides exceptional bond strength, outstanding thermal stability, and excellent resistance to chemicals and environmental stress.

Supplied in a convenient 2.5-gram pre-measured burst packet, EPO-TEK 353ND ensures accurate mixing ratios every time, reducing waste and simplifying assembly processes.

Features and Benefits

High Reliability for Critical Applications

Delivers strong, durable bonds in optical alignments, fiber optic terminations, semiconductor packaging, and other precision assemblies where long-term performance is essential.

Visual Cure Verification

The epoxy changes to a distinctive amber color when fully cured, providing a quick visual confirmation of proper processing.

Excellent Thermal and Chemical Resistance

Maintains performance in demanding environments exposed to elevated temperatures, chemicals, and thermal cycling.

NASA Low Outgassing Qualified

Meets ASTM E595 low outgassing requirements when cured according to the recommended schedule, making it suitable for aerospace, vacuum, and sensitive electronic applications.

Superior Optical Performance

Provides excellent transmission across key near-infrared wavelengths commonly used in fiber optic communication systems.

Extended Working Time

Offers up to 3 hours of pot life, allowing sufficient time for component positioning, alignment, and assembly.

Technical Specifications

• Product Type: Two-Component Heat Cure Epoxy

• Package Size: 2.5 g Burst Packet

• Consistency: Pourable Liquid

• Viscosity at 23°C: 3,000 – 5,000 cPs

• Glass Transition Temperature (Tg): ≥ 90°C (194°F)

• Shore D Hardness: 85

• Refractive Index (Uncured): 1.5694 at 589 nm

• Maximum Intermittent Operating Temperature: Up to 350°C (662°F)

Coefficient of Thermal Expansion (CTE)

• Below Tg: 54 × 10⁻⁶ in/in/°C

• Above Tg: 206 × 10⁻⁶ in/in/°C

Optical Transmission Performance

• 550 nm: ≥ 50%

• 800 – 1000 nm: ≥ 98%

• 1100 – 1600 nm: ≥ 95%

Handling and Cure Information

• Pot Life: Up to 3 Hours

• Recommended Cure Schedule: 1 Hour at 150°C

Typical Applications

• Fiber optic connector termination

• Fiber optic component assembly

• Optical alignment and bonding

• Semiconductor packaging

• Hybrid microelectronics

• Medical device assembly

• Aerospace and vacuum applications

• Photonics and laser systems

EPO-TEK® 353ND remains one of the most widely specified high-temperature epoxies for precision optical and electronic assemblies where reliability, thermal stability, and optical performance are critical.