EPO-TEK® 353NDT Thixotropic High Temperature Epoxy, Heat Cure (2.5g Packet)

EPO-TEK® 353NDT is a high-performance, two-part thixotropic epoxy designed for applications requiring exceptional thermal stability, controlled adhesive placement, and long-term reliability. Based on the proven EPO-TEK 353ND chemistry, this non-flowing formulation is ideal for fiber optic assemblies, electronic packaging, hybrid microelectronics, medical devices, and other applications where adhesive migration must be minimized.

Its smooth paste consistency allows precise dispensing onto vertical surfaces and complex assemblies without running or sagging. The epoxy also features a unique amber color change upon curing, providing a convenient visual indication of proper processing.

Supplied in a convenient 2.5-gram packet for accurate mixing and reduced material waste.

Features and Benefits

Thixotropic Non-Sag Formula

Designed to stay in place after application, making it ideal for vertical surfaces, gap filling, and assemblies requiring precise adhesive placement.

High Temperature Performance

Provides outstanding thermal stability and can withstand prolonged exposure to elevated temperatures in demanding environments.

Visual Cure Verification

Changes to an amber color after proper curing, allowing easy inspection and confirmation of the curing process.

Long Working Life

Offers up to 3 hours of pot life, providing ample time for assembly, alignment, and processing.

Excellent Multi-Substrate Adhesion

Bonds strongly to metals, glass, ceramics, and many engineering plastics.

Ideal for Precision Optical and Electronic Assemblies

Suitable for fiber optic packaging, circuit assembly, sensor packaging, and high-reliability electronic applications.

Proven 353ND Performance

Combines the reliability and environmental resistance of EPO-TEK 353ND with the added benefits of a thixotropic, non-flowing formulation.

Technical Specifications

• Product Type: Two-Part Thixotropic Heat Cure Epoxy

• Package Size: 2.5 g Packet

• Consistency: Smooth Thixotropic Paste

• Color Before Cure:

  • Part A: Tan

  • Part B: Amber

• Thixotropic Index: 3.8

• Viscosity at 23°C: 9,000 to 15,000 cPs

• Glass Transition Temperature (Tg): ≥ 90°C

• Shore D Hardness: 80

• Particle Size: 99% ≤ 20 Microns

• Suggested Operating Temperature:

  • Up to 325°C Intermittent

  • Up to 617°F Intermittent

Coefficient of Thermal Expansion (CTE)

• Below Tg: 43 × 10⁻⁶ in/in/°C

• Above Tg: 231 × 10⁻⁶ in/in/°C

Handling and Processing

• Working Life (Pot Life): Up to 3 Hours

• Recommended Cure Schedule: 150°C (302°F) for 1 Hour

Typical Applications

Fiber Optic Applications

• Fiber optic component assembly

• Optical packaging

• Fiber ferrule bonding

• Optical alignment assemblies

• Optoelectronic device packaging

Electronics and Hybrid Applications

• Circuit assembly

• Hybrid microelectronics

• Sensor packaging

• Electronic component bonding

• High-temperature electronic assemblies

Medical and Industrial Applications

• Medical device assembly

• Precision instrumentation

• Industrial sensor systems

• High-reliability structural bonding

Why Choose EPO-TEK 353NDT?

EPO-TEK 353NDT combines the proven performance of EPO-TEK 353ND with a highly thixotropic, non-flowing formulation that enables precise adhesive placement without sagging or migration. It is an excellent choice for applications requiring high-temperature resistance, reliable bonding, and controlled dispensing characteristics.

Storage and Shelf Life

Store refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.