ÅngströmBond® AB9001MTUP Thixotropic Clear Epoxy, Room Temperature & Heat Cure (2.5g)
ÅngströmBond® AB9001MTUP Thixotropic Clear Epoxy, Room Temperature & Heat Cure (2.5g Packet)
ÅngströmBond® AB9001MTUP is a high-viscosity, thixotropic two-part epoxy specifically designed for MT and MTRJ fiber optic connector assemblies. Its non-sagging consistency helps keep the adhesive precisely where it is applied, making it ideal for connector termination, sealing, and encapsulation applications that require controlled epoxy placement.
This clear epoxy cures at room temperature or with heat and is formulated to produce minimal stress during curing. The low-stress characteristics help prevent fiber cracking and maintain long-term reliability in both single-mode and multimode fiber optic connectors. The clear finish also allows for easy inspection and polishing during connector manufacturing.
Supplied in a convenient 2.5-gram packet for accurate mixing and reduced waste.
Features and Benefits
Designed for MT and MTRJ Connectors
Optimized for multi-fiber connector assemblies where precise adhesive placement and low curing stress are critical.
Thixotropic Non-Sag Formula
High viscosity prevents epoxy flow and migration, allowing accurate placement during assembly and curing.
Low-Stress Curing Performance
Helps eliminate fiber cracking and reduces stress on both single-mode and multimode optical fibers.
Clear for Easy Inspection and Polishing
Transparent cured epoxy simplifies polishing operations and visual inspection of connector end faces.
Excellent Sealing and Encapsulation Properties
An excellent choice for sealing, potting, and encapsulating small optical and electronic assemblies.
Strong Multi-Substrate Adhesion
Bonds securely to glass, ceramics, metals, and many engineering plastics.
Resistant to Harsh Environments
Provides excellent impact resistance as well as resistance to moisture and many industrial chemicals.
Flexible Processing Options
Can be cured at room temperature or with heat to accommodate various production requirements.
Technical Specifications
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Product Type: Two-Part Thixotropic Epoxy
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Package Size: 2.5 g Packet
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Color: Clear
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Mixed Viscosity at 25°C: 50,000 to 55,000 cPs
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Glass Transition Temperature (Tg): 93°C
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Shore D Hardness: 78
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Service Temperature Range: -65°C to 130°C (-85°F to 266°F)
Handling and Processing
Working Life
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30 to 45 Minutes
Recommended Centrifuge Cycle
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5 Minutes at 3,500 RPM
Minimum Cure Schedules
Room Temperature Cure
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25°C: 18 Hours
Accelerated Heat Cure
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65°C: 1 Hour
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90°C: 15 Minutes
Typical Applications
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MT connector assembly
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MTRJ connector assembly
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Multi-fiber connector termination
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Single-mode fiber optic connectors
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Multimode fiber optic connectors
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Fiber optic ferrule bonding
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Optical component assembly
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Potting and encapsulation
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Sealing small optical assemblies
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Telecommunications manufacturing
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Fiber optic production environments
Storage and Shelf Life
Store refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.