EPO-TEK® 353ND High Temperature Epoxy, Heat Cure (4g Packet)

EPO-TEK® 353ND is an industry-leading, two-part high-temperature epoxy designed for demanding semiconductor, fiber optic, medical, hybrid microelectronics, and aerospace applications. Known for its exceptional reliability, low outgassing characteristics, and superior resistance to moisture and harsh environments, 353ND has become one of the most widely specified optical and electronic assembly adhesives in the industry.

This high-performance epoxy provides strong adhesion, excellent thermal stability, and outstanding optical transmission properties, making it ideal for fiber optic packaging, active optical alignment, semiconductor packaging, and high-reliability electronic assemblies.

Supplied in a convenient 4-gram packet for accurate mixing and reduced waste.

Features and Benefits

Industry-Proven High-Reliability Epoxy

Widely used in semiconductor, fiber optic, aerospace, and medical device manufacturing where long-term performance is critical.

High Temperature Performance

Designed to withstand demanding thermal environments while maintaining bond strength and reliability.

Low Outgassing Formulation

Meets NASA ASTM E595 low outgassing requirements when cured according to the recommended schedule, making it suitable for vacuum and aerospace applications.

Visual Cure Verification

Changes to an amber color after curing, allowing easy visual confirmation of proper processing.

Excellent Moisture Resistance

Provides long-term protection in humid and harsh environmental conditions.

Outstanding Optical Performance

Offers excellent transmission in the near-infrared wavelength range commonly used in fiber optic communications.

Electrically and Thermally Insulating

Suitable for electronic packaging and electrical insulation applications.

Telcordia Qualified Design

Designed to meet Telcordia GR-1221 requirements for fiber optic component applications.

Technical Specifications

• Product Type: Two-Part Heat Cure Epoxy

• Package Size: 4 g Packet

• Consistency: Pourable Liquid

• Viscosity at 23°C: 3,000 to 5,000 cPs

• Glass Transition Temperature (Tg): ≥ 90°C

• Shore D Hardness: 85

• Suggested Operating Temperature:

  • Up to 350°C Intermittent

  • Up to 662°F Intermittent

• Refractive Index (Uncured): 1.5694 at 589 nm

Coefficient of Thermal Expansion (CTE)

• Below Tg: 54 × 10⁻⁶ in/in/°C

• Above Tg: 206 × 10⁻⁶ in/in/°C

Optical Properties

Spectral Transmission

• ≥ 50% at 550 nm

• ≥ 98% at 800–1000 nm

• ≥ 95% at 1100–1600 nm

Handling and Processing

• Working Life (Pot Life): Up to 3 Hours

• Recommended Centrifuge Cycle: 5 Minutes at 3,500 RPM

• Recommended Cure Schedule: 1 Hour at 150°C (302°F)

Typical Applications

Fiber Optic Applications

• Fiber optic connector termination

• Fiber optic component packaging

• Active optical alignment

• Environmental sealing of opto-electronic packages

• V-groove array assembly

• Fiber ferrule bonding

• Optical communication components

Semiconductor Applications

• Wafer-to-wafer bonding

• Chip scale package (CSP) assembly

• MEMS device fabrication

• Flip chip underfill

Hybrid and Sensor Applications

• Near-hermetic sealing

• Ultra-high vacuum (UHV) sensor packaging

• High-temperature electronic packaging

• Down-hole petrochemical fiber optic sensors

• Industrial sensing systems

Electronics Assembly

• Capacitor fabrication

• PZT ferroelectric lamination

• Motor and inductor coil insulation

• Ferrite core bonding

• Magnet bonding

• Hard disk drive assembly

• Structural electronic packaging

Storage and Shelf Life

Store refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.