EPO-TEK® 360 Low Viscosity Optical Epoxy, Heat Cure (4g Packet)

EPO-TEK® 360 is a low-viscosity, high-temperature, two-part optical epoxy designed for demanding fiber optic, semiconductor, photonics, and electronic assembly applications. Its exceptionally low viscosity allows for superior wicking and capillary action, making it an ideal choice for fiber termination, underfill applications, optical assemblies, and precision bonding where deep penetration and uniform coverage are required.

This unfilled optical epoxy provides outstanding light transmission across visible and near-infrared wavelengths while delivering excellent thermal stability, electrical insulation, and long-term reliability. A built-in color change from clear to amber upon curing provides convenient visual confirmation of proper processing.

Supplied in a convenient 4-gram packet for accurate mixing and reduced material waste.

Features and Benefits

Ultra-Low Viscosity for Wicking and Capillary Action

Flows easily into narrow gaps, ferrules, capillaries, and underfill regions for precise and uniform adhesive distribution.

Excellent Optical Transmission

Unfilled epoxy formulation provides exceptional transmission in visible and near-infrared wavelengths.

Visual Cure Verification

Changes from clear to amber when fully cured, allowing quick inspection and confirmation of proper curing.

High Temperature Performance

Designed for demanding thermal environments encountered in optical, electronic, and semiconductor applications.

Extended Working Life

Provides up to 6 hours of pot life, allowing ample time for assembly, alignment, and production processing.

Electrically Insulating

Offers excellent dielectric properties for electronic packaging and electrical insulation applications.

Strong Multi-Substrate Adhesion

Bonds well to glass, ceramics, metals, ferrites, optical fibers, and electronic components.

Technical Specifications

• Product Type: Two-Part Heat Cure Optical Epoxy

• Package Size: 4 g Packet

• Consistency: Pourable Liquid

Color Before Cure

• Part A: Clear / Colorless

• Part B: Amber

Physical Properties

• Viscosity at 23°C: 350 to 550 cPs

• Glass Transition Temperature (Tg): ≥ 90°C

• Shore D Hardness: 87

• Suggested Operating Temperature:

  • Up to 300°C (572°F)

Coefficient of Thermal Expansion (CTE)

• Below Tg: 39 × 10⁻⁶ in/in/°C

• Above Tg: 175 × 10⁻⁶ in/in/°C

Electrical Properties

• Volume Resistivity at 23°C: ≥ 2 × 10¹³ Ohm-cm

• Dielectric Constant (1 kHz): 3.74

• Dissipation Factor (1 kHz): 0.011

Optical Properties

Spectral Transmission

• Greater than 97% at 700–1600 nm

• Greater than 88% at 600 nm

• Greater than 51% at 500 nm

Refractive Index

• 1.5345 at 589 nm (Uncured)

Handling and Processing

• Working Life (Pot Life): Up to 6 Hours

• Recommended Cure Schedule: 150°C (302°F) for 1 Hour

Typical Applications

Fiber Optic and Photonics Applications

• Fiber termination into ferrules

• Polarization-maintaining fiber (PMF) assemblies

• Optical component packaging

• Optical alignment applications

• Fiber optic sensor assemblies

• Photonics device packaging

Semiconductor Applications

• Flip-chip underfill

• Capillary-flow underfill applications

• Semiconductor packaging

• Microelectronic assembly

Electronics Applications

• Copper coil impregnation

• SMD inductor coil assembly

• Ferrite core bonding

• Electronic component encapsulation

• Electrical insulation applications

Why Choose EPO-TEK 360?

EPO-TEK 360 combines extremely low viscosity, excellent optical transmission, and high-temperature performance in a single adhesive system. Its superior capillary action and long working life make it an excellent choice for fiber optic assemblies, semiconductor underfill applications, and precision optical packaging where controlled flow and high optical clarity are essential.

Storage and Shelf Life

Store refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.