Minimum Order Quantity: 25x

ÅngströmBond® AB9590 Thermally Conductive Black Epoxy, Room Temperature Cure (2.5 g)

Part Number: AB9590-2.5G

The ÅngströmBond® AB9590 is a two-part, thermally conductive epoxy adhesive and potting compound designed for applications requiring both efficient heat transfer and mechanical flexibility. Its room-temperature curing formulation makes it ideal for bonding, encapsulating, and protecting sensitive electronic assemblies without the need for elevated-temperature curing equipment.

Unlike rigid thermal epoxies that can place stress on delicate components, AB9590 cures to a flexible, resilient material that helps protect fragile electronic devices, fine-gauge wires, sensors, and temperature-sensitive assemblies. The low mixed viscosity allows the epoxy to flow easily into small gaps and complex geometries, making it suitable for potting, encapsulation, coating, and adhesive bonding applications.

The black epoxy formulation provides thermal conductivity while delivering reliable environmental protection against vibration, mechanical shock, and handling stresses. Its combination of thermal management properties and flexible cured characteristics makes AB9590 an excellent choice for electronics, optoelectronics, photonics, and industrial applications.

Supplied in a convenient 2.5 g packet, AB9590 is ideal for prototyping, laboratory work, small-scale production, and field repair applications.

Features and Benefits

• Two-part thermally conductive epoxy adhesive and potting compound

• Room-temperature curing formulation

• Flexible cured material for sensitive and fragile components

• Excellent for bonding, potting, and encapsulation applications

• Low mixed viscosity for easy dispensing and application

• Helps dissipate heat from electronic assemblies

• Suitable for fine electrical wires and delicate devices

• Black epoxy formulation

• Provides environmental and mechanical protection

• Convenient 2.5 g package for small-volume applications

Physical Properties

Handling Characteristics

Cure Schedule

Typical Applications

• Electronic component bonding

• Thermal management assemblies

• Potting and encapsulation

• Sensor protection

• Fiber optic and photonics assemblies

• Fine-wire electrical connections

• Laboratory and prototype development

• Industrial electronic equipment

Packaging

• 2.5 g packet

Important Notice

Shelf life information is available upon request. Store according to manufacturer recommendations to maximize product performance and working life.