Customized 800GBASE 2xDR4/DR8 OSFP Finned Top PAM4 1310nm 500m DOM Dual MPO-12/APC SMF Optical Transceiver Module

The 800GBASE-DR8 OSFP optical transceiver module is designed for 800GBASE network throughput up to 500m link lengths over OS2 single-mode fiber (SMF) using a wavelength of 1310nm via dual MTP/MPO-12 APC connectors.

This transceiver is compliant with IEEE 802.3ck, IEEE 802.3cu and OSFP MSA standards. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters.

The twin-port OSFP finned-top transceiver is used in air-cooled switches. Featured with low latency, low power, and reliability, it can link upward in spine-leaf architectures for switch-to-switch applications, downward for top-of-rack switch links to network adapters, and/or to BlueField-3 DPUs in compute servers and storage subsystems.

It is the ideal solution for HPC computing, AI, and cloud data centers.

Specifications

• Part Number: FS-OSFP-DR8-800G
  
• Form Factor: Twin-port OSFP Finned Top
  
• Max Data Rate: 850Gbps (8x 106.25Gbps)
  
• Wavelength: 1310nm
  
• Max Cable Distance: 500m
  
• Connector: Dual MTP/MPO-12 APC
  
• Media: SMF
  
• Transmitter Type: EML
  
• Receiver Type: PIN
  
• TX Power: -2.9~4.0dBm
  
• Minimum Receiver Power: -5.9dBm
  
• Power Budget: 3dB
  
• Receiver Overload: 4dBm
  
• Max Power Consumption: 16.5W
  
• Extinction Ratio: >3.5dB
  
• Modulation (Electrical): 8x100G-PAM4
  
• Modulation (Optical): Dual 4x100G-PAM4
  
• Packaging Technology: COB (Chip on Board) Packaging
  
• Modulation Format: PAM4
  
• CDR (Clock and Data Recovery): TX & RX Built-in DSP
  
• Inbuilt FEC: No
  
• Protocols: OSFP MSA HW Rev 4.1, CMIS Rev 5.0, IEEE 802.3cu-2021, IEEE P802.3ck D2.2
  
• Warranty: 5 Years

Product Highlights

• Connect New 800G Sites to Legacy 400G Sites via 2x400G Breakout
  
• Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 16.5W
  
• Support 2x 400G, 4x 200G or 8x 100G Breakout for Higher Port Density
  
• 8x106.25G PAM4 Retimed 800GAUI-8 Electrical Interface
  
• High-speed Connectivity Compliant to IEEE 802.3ck and IEEE 802.3cu-2021
  
• Parameter Tests for Superior Performance, Quality, and Reliability
  
• Hot Pluggable OSFP MSA Compliant
  
• Self-developed 53G EML Laser Chip to Ensure Production
• Center Wavelength: 1310nm
• Connector: Dual MTP/MPO-12
• Cable Distance (Max.): 500m@SMF
• Modulation: 8x106.25G PAM4
• Transmitter Type: EML
• Packaging Technology: COB (Chip on Board) Packaging
• Chip: Broadcom 7nm DSP
• Power Consumption: ≤16.5W
• Application: Ethernet; Data Center; 800G to 2x400G Breakout; 800G to 8x100G Breakout

InfiniBand Products and Testing

Connectivity Solutions

Transceiver Customization for Full Compatibility
Configuring with FS BOX or Coding Board and testing in the targeted switch environment for high-performance interoperability.

Online Custom Label Service Tailored to Your Needs
Custom labels for easy identification to help ease receiving, stocking and deployment.