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EPO-TEK® HYB-353ND High Temperature Epoxy, Hybrid Heat & UV Cure - Pre-Mixed and Frozen (3cc Syringe)

Part No.: ETHYB-353ND-3CC

  • $ 22.50


EPO-TEK® HYB-353ND Hybrid UV & Heat Cure High Temperature Epoxy, Premixed & Frozen, 2.87cc Syringe (MOQ: 100)

EPO-TEK® HYB-353ND is a hybrid UV and heat-curable epoxy adhesive designed for high-performance semiconductor, fiber optic, photonic, and medical device applications. Developed to provide cured properties similar to the industry-standard EPO-TEK 353ND, HYB-353ND incorporates UV-tacking capability, allowing components to be rapidly positioned and secured prior to final thermal curing.

This dual-cure system enables improved assembly efficiency by combining the speed of UV fixation with the long-term thermal and mechanical performance of a high-temperature epoxy. The pourable liquid consistency provides excellent dispensing characteristics for automated production environments, while the premixed and frozen packaging eliminates mixing errors and ensures consistent process results.

Supplied in a 2.87cc fill volume within a 3cc automatic dispensing syringe, HYB-353ND is ideal for precision optical alignment, photonic packaging, semiconductor assembly, and medical device manufacturing.

Minimum Order Quantity: 100 Pieces

Features & Benefits

  • Hybrid UV and heat-cure epoxy system

  • UV tacking capability for rapid component positioning

  • High-temperature performance comparable to EPO-TEK 353ND

  • Premixed and frozen formulation for process consistency

  • Eliminates weighing and mixing requirements

  • Excellent optical transmission in the near-infrared region

  • Suitable for automated dispensing equipment

  • Ideal for semiconductor, fiber optic, and medical device applications

Typical Applications

  • Fiber optic component assembly

  • Optical alignment and tacking

  • Photonic device packaging

  • Semiconductor packaging

  • Optoelectronic assembly

  • Medical device manufacturing

  • Sensor packaging

  • Precision electronic assembly

Technical Specifications

Property Value
Product Type Hybrid UV & Heat Cure Epoxy
Components Premixed & Frozen
Packaging 2.87cc Fill in 3cc Automatic Syringe
Consistency Pourable Liquid
Pot Life Less Than 2 Hours
Viscosity (23°C) 3,000 – 7,000 cPs
Glass Transition Temperature (Tg) ≥ 100°C (212°F)
Shore D Hardness 78
CTE Below Tg 78 × 10⁻⁶ in/in/°C
CTE Above Tg 138 × 10⁻⁶ in/in/°C
Suggested Operating Temperature Up to 350°C (662°F) Intermittent
Refractive Index (Uncured) 1.5259 @ 589 nm

Optical Properties

Property Value
Spectral Transmission @ 550 nm ≥ 50%
Spectral Transmission @ 800–1000 nm ≥ 98%
Spectral Transmission @ 1100–1600 nm ≥ 95%

Advantages of Hybrid UV & Heat Cure Technology

HYB-353ND allows components to be temporarily secured with UV exposure before undergoing a final thermal cure. This process improves assembly throughput, maintains precise optical alignment, and provides the high-temperature performance required for demanding photonic, semiconductor, and medical applications.

Markets Served

  • Fiber Optics

  • Photonics

  • Optoelectronics

  • Semiconductor Manufacturing

  • Medical Devices

  • Electronic Packaging

  • Sensor Manufacturing

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