FS-N8550-32C, Bare Metal Switch, 32-Port Ethernet Data Center, 32 x 100Gb FS-QSFP28, 2 x 10Gb SFP+, Broadcom Trident 3-X7 Chip
FS-N8550-32C, Bare Metal Switch, 32-Port Ethernet Data Center, 32 x 100Gb FS-QSFP28, 2 x 10Gb SFP+, Broadcom Trident 3-X7 Chip
FS-N8550-32C is a leaf/spine switch for data centers, it provides line-rate L2 and L3 switching across the 32x 100GbE FS-QSFP28 or 40GbE QSFP+ port in a compact 1U form factor. It is optimally deployed as a leaf or spine switch supporting 10/40/100GbE leaf/spine interconnects.
The switch is loaded with the Open Network Install Environment (ONIE), which supports the installation of compatible Network Operating System software, including the commercial PicOS® offerings.
Specifications
- Ports: 32x 100G QSFP28 | 2x 10Gb SFP+
- Switching Capacity: 3.2Tbps
- Switch Chip: Broadcom BCM56870 Trident 3
- Forwarding Rate: 4700 Mpps
- CPU: Intel® Xeon® D-1518 processor quad_x0002_core 2.2 GHz
- Packet Buffer: 32MB
- Power Supplies: 2 (1+1 Redundancy) Hot-swappable, AC
- Jumbo Frame: 9,216
- Fans: 6x Hot-swappable Fans, Rear-Front
- SDRAM: 2x 8GB SO-DIMM DDR4
- Dimensions (HxWxD): 1.71"x 17.26"x 21.1" (43.5x 438.4x 536mm)
- Flash Memory: 64GB
- Weight: 22.05 lbs (10kg)
- SPI Flash: 16 MB x 2
- Operating Temperature: 32°F to 104°F (0°C to 40°C)
- Input Voltage: 100-240VAC, 50-60Hz
- Storage Temperature: -40°F to 158°F (-40°C to 70°C)
- Max. Power Consumption: 550W
- Operating Humidity: 5% to 95% (Non-condensing)
- Rack Unit: 1 RU
- Switch Chip: Broadcom BCM56870 Trident 3-X7
- Ports: 32x 100G QSFP28 | 2x 10Gb SFP+
- Switching Capacity: 3.2 Tbps
Product Highlights
- Broadcom BCM56870 Trident 3-X7 Chip, 3.2 Tbps Throughput
- 32x 100G QSFP28, 2x 10G SFP+ Management Port
- Forwarding Rate: 4700 Mpps
- 1+1 Hot-swappable Power Supplies, 5+1 Hot-swappable Smart Fans
- Support PicOS® Network Operating System
- AmpCon-DC Management Platform Provides Full Day 0 to Day 2+ Capabilities
- Power Supplies: 2 (1+1 Redundancy) Hot-swappable, AC
- Fans: 6 (5+1 Redundancy), Rear-Front
- Max. Power Consumption: 550W
Connectivity Solutions
Flexible Interface Speeds for Multi-scenario Deployment
10G for servers, 40/100G uplinks for spine switches.
FS-BCM56870 Trident 3 Delivers a Glueless Network Connectivity
The FS-BCM56870 is a high-capacity device, which delivers high-bandwidth, glueless network connectivity of up to 3.2 Tb/s on a single chip along with the new 10GbE and 100GbE IEEE standards.
Hardware-level Redundancy Ensures Network Stability
Hot-swappable redundant power supplies and fans ensure high reliability and intelligent, efficient heat dissipation to support the development of low-carbon data centers.
1+1 Dual AC PSU
PSUs can be removed/replaced without shutting down the system
5+1 Hot-swap Fans
Variable-speed fans for superior cooling, noise and power reduction
PicOS® Ensures Stable and Secure Network Operations
PicOS® features a modular design for independent component operation, a dual-partition rollback for quick restoration, comprehensive L2/L3 features, and various security authentication methods to enhance network reliability and availability.
AmpCon-DC Automated Configuration and Unified Management
AmpCon-DC management platform offers Day 0 to Day 2+ capabilities to manage PicOS® data center switches, enabling provisioning, monitoring, troubleshooting, and maintenance for higher resource utilization and lower opex.