FS-N8550-48B8C, Bare Metal Switch, 48-Port Ethernet Data Center, 48 x 25Gb SFP28, 8 x 100Gb FS-QSFP28 Uplinks, with 2 x 10Gb SFP+ Management Port, Broadcom Trident 3-X7 Chip
FS-N8550-48B8C, Bare Metal Switch, 48-Port Ethernet Data Center, 48 x 25Gb SFP28, 8 x 100Gb FS-QSFP28 Uplinks, with 2 x 10Gb SFP+ Management Port, Broadcom Trident 3-X7 Chip
FS-N8550-48B8C is a leaf switch for data centers, it provides line-rate L2 and L3 switching across the 48x 25G SFP28 downlink and 8x 40/100G FS-QSFP28 uplink port in a compact 1U form factor.
It is optimally deployed as a leaf switch supporting 10/25/40/100GbE leaf interconnects.
The switch is loaded with the Open Network Install Environment (ONIE), which supports the installation of compatible Network Operating System software, including the commercial PicOS® offerings.
Specifications
- Ports: 48x 25G SFP28 | 8x 100G QSFP28, 2x 10G SFP+
- Switching Capacity: 2 Tbps
- Switch Chip: Broadcom BCM56873 Trident 3
- Forwarding Rate: 2000 Mpps
- CPU: Intel® Xeon® D-1518 processor quad_x0002_core 2.2 GHz
- Packet Buffer: 32MB
- Power Supplies: 2 (1+1 Redundancy) Hot-swappable, AC
- Jumbo Frame: 9,216
- Fans: 6x Hot-swappable Fans, Rear-Front
- SDRAM: 2x 8GB SO-DIMM DDR4
- Dimensions (HxWxD): 1.72"x 17.26"x 20.28" (43.8x 438.4x 515mm)
- Flash Memory: 64GB
- Weight: 23.96 lbs (10.87kg)
- SDRAM: 16 MB x2
- Operating Temperature: 32°F to 113°F (0°C to 45°C)
- Flash Memory: 100-240VAC, 50-60Hz
- Storage Temperature: -40°F to 158°F (-40°C to 70°C)
- SPI Flash: 550W
- Operating Humidity: 5% to 95% (Non-condensing)
- Input Voltage: 1 RU
- Max. Power Consumption: 550W
Product Highlights
- Flexible 10/25/40/100GbE Interface Speeds
- Broadcom BCM56873 Trident III, Intel Xeon D-1518 Processor Quad-core 2.2 GHz
- 1+1 Hot-swappable Power Supplies, 5+1 Smart Fans
- Support PicOS® Network Operating System
- AmpCon-DC Management Platform Provides Full Day 0 to Day 2+ Capabilities
Connectivity Solutions
High-speed and Flexible Interface Enhance Network Performance
10/25G for servers and 40/100G uplinks for spine switches provide high-speed, low-latency networks, with the low-power design optimizing energy usage and reducing heat dissipation.
BCM56873 Trident 3 Delivers a Glueless Network Connectivity
The BCM56873 is a high-capacity device, which delivers high-bandwidth, glueless network connectivity of up to 2 Tb/s on a single chip along with the new 25GbE and 40/100GbE IEEE standards.
Hardware-level Redundancy Ensures Network Stability
Hot-swappable redundant power supplies and fans ensure high reliability and intelligent, efficient heat dissipation to support the development of low-carbon data centers.
PicOS® Ensures Stable and Secure Network Operations
PicOS® features a modular design for independent component operation, a dual-partition rollback for quick restoration, comprehensive L2/L3 features, and various security authentication methods to enhance network reliability and availability.
AmpCon-DC Automated Configuration and Unified Management
AmpCon-DC management platform offers Day 0 to Day 2+ capabilities to manage PicOS® data center switches, enabling provisioning, monitoring, troubleshooting, and maintenance for higher resource utilization and lower opex.
