Intel X710-BM2 Based Ethernet Network Interface Card, 10G Dual-Port SFP+, OCP 3.0, PCIe 3.0 x 8, Comparable to Intel X710-DA2 OCP 3.0, Thumbscrew (Pull-tab) Bracket

The Intel® Ethernet 700 Series delivers networking performance across a wide range of network port speeds through intelligent offloads, sophisticated packet processing, and quality open source drivers. With two 10GbE SFP+ ports and key performance optimizations, the X710BM2 for OCP 3.0 supports Cloud, Enterprise, and Communications solutions.

The OCP NIC 3.0 specification defines a standardized design for a new generation of network adapters. Simple and straightforward form factors, clear manageability requirements, and improved serviceability help simplify deployment for current and emerging capabilities.

Specifications

• Port: Dual
  
• Controller: X710BM2
  
• Data Rate: 10GbE
  
• Host Interface: PCIe 3.0 x 8
  
• Connector Type: SFP+
  
• Bracket Height: OCP 3.0
  
• Connectivity (VT-c): Yes
  
• Storage Over Ethernet: iSCSI, NFS
  
• SR-IOV: Yes
  
• GENEVE: Yes
  
• VXLAN: Yes
  
• DPDK: Yes
  
• RoCE: No
  
• OS Support: Windows, Linux, FreeBSD
  
• Storage Humidity: 90% max. non-condensing relative humidity at 35ºC
  
• Operating Humidity: 85% max. non-condensing relative humidity
  
• Storage Temperature: -40 °C to 70 °C (-40 °F to 158 °F）
  
• Operating Temperature: 0°C to 55 °C (32 °F to 131 °F)

Product Highlights

• OCP NIC 3.0 Accommodates High-Density Deployments to Improve
• Interoperability and Compatibility for Seamless Integration
  
• Low Power Intel X710-BM2 Adapts to High-Density Green Data Center Needs
  
• Supports Geneve, VXLAN, and NVGRE for High Throughput and Lower CPU Usage
  
• Data Plane Development Kit (DPDK) Optimised for Efficient Packet Processing
  
• Excellent Small Packet Performance for Network Appliances and Network Functions Virtualization
• SR-IOV: YES
• VMDq: YES
• DPDK: YES
• NVGER: YES
• GENEVE: YES
• VXLAN: YES
• Connectivity (VT-c): YES
• Card PCB Dimensions (WxD): 4.59"x2.99" (116.61x76mm) with bracket

Product Spotlights

Virtualization Features

• Next-Generation VMDq
• PCI-SIG SR-IOV implementation
• Virtual machine load balancing (VLMB)
• Advanced packet filtering
• VXLAN and NVGRE support

Advanced Software Features

• Adapter fault tolerance (AFT)
• Switch fault tolerance (SFT)
• Adaptive load balancing (ALB)
• IEEE 802.3 (link aggregation control protocol)
• IEEE 802.1Q* VLANs
• TCP segmentation/large send offload
• MSI-X support
• Tx/Rx IP, SCTP, TCP, and UDP checksum offloading (IPv4, IPv6) capabilities

Manageability Features

• Preboot eXecution Environment (PXE) Support
• SNMP and RMON statistic counters
• iSCSI Boot
• Watchdog Timer

Connectivity Solutions

CP NIC 3.0 Enables Compact Servers for High-Power NICs
OCP NIC 3.0, with simple form factors, clear manageability, and improved serviceability, integrates Intel X710 chips to cut power use, simplifying deployment for current/emerging capabilities.

Advanced Networking and Security
Intel X710 supports SR-IOV, Intel® Data Direct I/O Technology, and protocols like Geneve and VXLAN, optimizing performance, offloading cloud network workloads, freeing CPU cores, enhancing security, and lowering TCO.

Unlock Seamless Network Performance with Compatibility Testing
The universal interface seamlessly integrates with mainstream server motherboards and supports multiple operating systems, reducing costs while safeguarding investment flexibility and future scalability.