TH-FRAV1 - Iridium Filament Assembly, ≤Ø200 µm Cladding
TH-FRAV1 - Iridium Filament Assembly, ≤Ø200 µm Cladding
- Filament Assemblies for CO2 Laser Glass Processor (One THFTAV4 Graphite Filament Included with Each System)
- Optimized for Splicing, Tapering, or Lensed Tip Applications (See Table to the Right for Details)
- Assembly Includes Filament Element and Protective Shroud
- Filament Material Iridium
- Cladding Diameter (Min/Max) ≤200 µm
- Application Splice