Tra-Con High Tg and Room Temperature Curing Fiber Optic Epoxy Adhesive ( Ground Shipment Only)
The item is packaged in a 2 gram rigid plastic tube separated by a leak-proof clamp (BIPAX). Remove the clamp and mix right inside the BIPAX. This eliminates mix ratio errors with pre-measured resin and catalyst components.This package will prepare approximately 25~30 connectors.
High Tg and Room Temperature Curing Fiber Optic Epoxy Adhesive
TRA-BOND F113SC is a room temperature curing, high Tg and low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors. It has also been used for bonding LED displays, lenses and other optical components.
TRA-BOND F113SC provides both high bond strength as well as low stress connections with no pistoning. This two part system can be cured overnight at room temperature or as quickly as 15 minutes at 9°C and is provided in a dark blue color to allow for easy polishing.
Please Note: Ground Shipment Only
Features:
- 2-Part, 2.5-Gram Bi-Pack
- Heat/Time Cure, 30mins - 24Hrs @ Room Temp to 80°C
- Blue Dye Epoxy
- 45 minute Pot Life in a Syringe
- Singlemode / Multimode Applications
Properties
- Color, resin Clear
- Color, hardener Dark Blue
- Color, mixed Dark Blue
- Specific gravity, mixed 1.1
- Index of refraction 1.52
- Viscosity, cps, mixed ((after mixing) @ 2°C) 1800
- Thixotropic index 1
- Operating temperature range,°C -60/120
- Hardness, Shore D 83
- Mix ratio, pbw, Resin/Hardener 100/30
- Lap shear, alum to alum, psi (1 hour @ 6°C) 3900
- Lap shear, alum to alum, psi (24 hours @ 2°C) 2700
- Glass transition (Tg),°C, ultimate 95
- Water absorption, % 0.98
- VOC, grams/l 1.91
- Coefficient of expansion, cm/cm°C (above Tg) 0.000191
- Coefficient of expansion, cm/cm°C (below Tg) 0.0000757
Cure Schedule
- 18 hours @ 2°C or
- 1 hour @ 6°C or
- 15 minutes @ 9°C for one drop applications