FS-S5870-48T6BC, Bare Metal Switch, 48-Port Ethernet L3 Enterprise, 48 x Gigabit RJ45, with 4 x 25Gb SFP28 and 2 x 100Gb FS-QSFP28 Uplinks, Broadcom Trident3-X3 Chip
FS-N5570-48S6C, 48-Port Ethernet Data Center Switch, 48 x 10Gb SFP+, with 6 x 100Gb QSFP28 Uplinks, PicOS®, Broadcom Trident 3 Chip
FS-N5850-48S6Q, 48-Port Ethernet Data Center Switch, 48 x 10Gb SFP+, with 6 x 40Gb QSFP+ Uplinks, PicOS®, Broadcom Trident 2+ Chip
Hot-swappable AC Power Module 150W, for FS-S5860-20SQ, FS-S5810-48FS Switches
ÅngströmBond® ÅnaeBond™ AB202 Fast Cure Adhesive, Room Temperature Cure (20ml Adhesive and 1.75oz Primer)
ÅngströmBond® ÅnaeBond™ AB101 Fast Cure Anaerobic Adhesive (10ml Adhesive and 1.75oz Primer)
EPO-TEK® 360 Low Viscosity Epoxy, Heat Cure (4g)
EPO-TEK® 323LP High Temperature Epoxy, Heat Cure (2.5g)
EPO-TEK® 383ND High Temperature Epoxy, Heat Cure (2.5g)
LW Scientific E8 Centrifuge - Touch Screen
EPO-TEK® 353NDT Thixotropic High Temperature Epoxy, Heat Cure (2.5g)
EPO-TEK® 353ND High Temperature Black Epoxy, Heat Cure (2.5g)
EPO-TEK® 353ND High Temperature Epoxy, Heat Cure (4g)
Fisnar DC100 MAX Digital Epoxy Dispensing Machine
ÅngströmBond® AB9001MT Thixotropic Epoxy, Room Temperature & Heat Cure (2.5g)
ÅngströmBond® AB9001MTUP Thixotropic Clear Epoxy, Room Temperature & Heat Cure (2.5g)
ÅngströmBond® AB9110LV Blue Epoxy for PM and POF fiber, Room Temperature & Heat Cure (2.5g)
ÅngströmBond® AB9110LV Clear Epoxy for PM and POF fiber, Room Temperature & Heat Cure (2.5g)
ÅngströmBond® AB9113SC Epoxy, Room Temperature & Heat Cure (2.5g)
Domaille CO-6500 Epoxy Curing Oven with MT Tray - 110V
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