Cooper B-Line Copper Antioxidant Joint Compound – 1/2 oz (12 Pack)

This copper-based antioxidant joint compound is designed to improve electrical continuity at grounding and bonding connections. By penetrating surface oxides and filling microscopic voids, it helps reduce resistance at metal-to-metal contact points, ensuring more reliable and long-lasting electrical performance. Packaged in convenient 1/2 oz containers, the compound is well suited for panel mounting, grounding bars, and other customer premise grounding applications where consistent conductivity is critical.

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Specifications

• Product Type: Antioxidant joint compound

• Material: Copper

• Application: Improves electrical continuity at grounding or bonding connections

• Package Size: 1/2 oz per container

• Packaging: Sold in packs of 12

• Typical Use: Panel mounting and grounding accessories

This copper joint compound provides a dependable solution for maintaining low-resistance grounding and bonding connections in electrical and communications installations.