EPO-TEK® 353ND Black High Temperature Epoxy, Heat Cure (2.5g Packet)

EPO-TEK® 353ND Black is a high-performance, two-part heat-cure epoxy specifically formulated for applications requiring both the proven reliability of EPO-TEK 353ND and excellent optical opacity. This black-pigmented version is designed for semiconductor, fiber optic, photonics, hybrid microelectronics, and medical device applications where blocking visible and infrared light is critical.

With outstanding thermal stability, strong adhesion, low shrinkage, and excellent environmental resistance, EPO-TEK 353ND Black is an ideal choice for optical packaging, sensor assemblies, photonic devices, and high-reliability electronic applications.

Supplied in a convenient 2.5-gram packet for accurate mixing and reduced material waste.

Features and Benefits

Excellent Optical Opacity

Specially color-coded black for applications requiring effective light blocking in both the visible and infrared wavelength ranges.

High Temperature Performance

Maintains excellent mechanical properties and bond strength in demanding thermal environments.

Proven 353ND Chemistry

Built on the industry-trusted EPO-TEK 353ND platform known for reliability in fiber optic, semiconductor, and electronic packaging applications.

Strong and Durable Bonds

Provides excellent adhesion to a wide range of materials used in optical and electronic assemblies.

Low Shrinkage and High Stability

Helps maintain alignment and dimensional stability in precision optical systems.

Ideal for Optical Packaging

Suitable for applications where stray light suppression, optical isolation, and sensor shielding are required.

Technical Specifications

• Product Type: Two-Part Heat Cure Epoxy

• Package Size: 2.5 g Packet

• Color: Black

• Consistency: Pourable Liquid

• Viscosity at 23°C: 3,000 to 5,000 cPs

• Glass Transition Temperature (Tg): ≥ 90°C (194°F)

• Shore D Hardness: 85

• Suggested Operating Temperature:

  • Up to 325°C Intermittent

  • Up to 617°F Intermittent

Coefficient of Thermal Expansion (CTE)

• Below Tg: 54 × 10⁻⁶ in/in/°C

• Above Tg: 206 × 10⁻⁶ in/in/°C

Optical Properties

Spectral Transmission

• Less than 3% at 1500 nm

The low transmission characteristics make this epoxy well suited for optical assemblies requiring suppression of unwanted light.

Handling and Processing

• Working Life (Pot Life): Less Than 2 Hours

• Recommended Cure Schedule: 150°C (302°F) for 1 Hour

Typical Applications

Fiber Optic and Photonics Applications

• Optical component packaging

• Fiber optic component assembly

• Optical sensor packaging

• Stray light suppression

• Optical isolation structures

• Active optical alignment assemblies

• Laser and photonics devices

Semiconductor Applications

• Semiconductor packaging

• MEMS device assembly

• Sensor packaging

• Electronic component bonding

Medical and Industrial Applications

• Medical device assembly

• Optical instrumentation

• Industrial sensor systems

• High-temperature electronic packaging

Storage and Shelf Life

Store refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.