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EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy – 8 oz Kit
EPO-TEK® 353ND-T Black is a two-component, heat-cure, high-temperature thixotropic epoxy designed for demanding fiber optic, PCB, electronic, and medical applications. Its smooth, non-flowing thixotropic consistency makes it particularly useful for applications where precise adhesive placement and resistance to running or sagging are important.
The black formulation provides low optical transmission across visible and near-infrared wavelengths, making it well suited for fiber optic and optoelectronic assemblies where stray-light control or an opaque adhesive bond is desirable.
Key Features
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Two-component, heat-cure epoxy system
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Black, opaque formulation
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Smooth thixotropic paste consistency
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Excellent resistance to flow and sagging during application
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Designed for high-temperature applications
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Suitable for fiber optic, PCB, electronic, and medical assemblies
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3-hour pot life
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10:1 mix ratio by weight
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Recommended cure: 150°C for 1 hour
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Glass transition temperature (Tg): ≥ 90°C
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Supplied as an 8 oz kit
Typical Physical Properties
| Property | Typical Value |
|---|---|
| Components | Two |
| Mix Ratio by Weight | 10:1 |
| Color | Black |
| Consistency | Smooth thixotropic paste |
| Pot Life | 3 hours |
| Viscosity @ 23°C | 9,000–15,000 cPs |
| Thixotropic Index | 3.8 |
| Glass Transition Temperature (Tg) | ≥ 90°C |
| Shore D Hardness | 80 |
| Particle Size | ≤ 20 µm |
| CTE Below Tg | 43 × 10⁻⁶ in/in°C |
| CTE Above Tg | 231 × 10⁻⁶ in/in°C |
| Suggested Operating Temperature | < 325°C intermittent |
| Recommended Cure | 150°C / 1 hour |
Optical Properties
The black formulation provides very low spectral transmission:
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< 5% transmission from 300–1460 nm
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< 7% transmission at 1550 nm
This low transmission can be advantageous in fiber optic and optoelectronic assemblies where unwanted light transmission through the adhesive needs to be minimized.
Typical Applications
EPO-TEK® 353ND-T Black is suitable for applications including:
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Fiber optic component assembly
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Fiber optic connector and ferrule bonding
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Optoelectronic packaging
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Optical component bonding
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PCB and electronic assembly
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Component staking and bonding
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Applications requiring a non-flowing epoxy
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High-temperature adhesive applications
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Selected medical-device assemblies
Cure Information
Recommended cure:
150°C for 1 hour
Alternative heat-cure schedules may be possible depending on the application and required performance. Cure conditions should be validated for the specific production process.
Package
Size: 8 oz kit
Type: Two-part heat-cure epoxy
Product: EPO-TEK® 353ND-T Black
Manufacturer: Epoxy Technology, Inc.