EPO-TEK® 353NDT Thixotropic High Temperature Epoxy, Heat Cure (4g Packet)

EPO-TEK® 353NDT is a high-performance, two-part thixotropic epoxy engineered for applications requiring exceptional thermal stability, precise adhesive placement, and long-term reliability. Based on the proven EPO-TEK® 353ND chemistry, this non-flowing formulation is ideal for fiber optic assemblies, circuit board manufacturing, hybrid microelectronics, medical devices, and other applications where adhesive migration must be minimized.

Its smooth thixotropic paste consistency allows accurate dispensing onto vertical surfaces and complex assemblies without running, sagging, or spreading. The epoxy also features a built-in amber color change upon curing, providing a convenient visual indication of proper processing.

Supplied in a convenient 4-gram packet for accurate mixing and reduced waste.

Features and Benefits

Thixotropic Non-Sag Formula

Designed to remain exactly where it is applied, making it ideal for vertical surfaces, gap-filling applications, and assemblies requiring controlled adhesive placement.

High Temperature Performance

Provides excellent thermal stability and can withstand prolonged exposure to elevated temperatures in demanding environments.

Visual Cure Verification

Changes to an amber color after proper curing, allowing easy inspection and confirmation of cure completion.

Extended Working Time

Offers up to 3 hours of pot life, providing ample time for assembly, positioning, and alignment.

Strong Multi-Substrate Adhesion

Bonds effectively to metals, glass, ceramics, and many engineering plastics.

Ideal for Precision Optical and Electronic Assemblies

Suitable for fiber optic packaging, circuit assembly, sensor packaging, and high-reliability electronic applications.

Proven High-Reliability Chemistry

Combines the reliability and environmental resistance of EPO-TEK® 353ND with the advantages of a highly thixotropic, non-flowing formulation.

Technical Specifications

• Product Type: Two-Part Thixotropic Heat Cure Epoxy

• Package Size: 4 g Packet

• Consistency: Smooth Thixotropic Paste

Color Before Cure

• Part A: Tan

• Part B: Amber

Physical Properties

• Thixotropic Index: 3.8

• Viscosity at 23°C: 9,000 to 15,000 cPs

• Glass Transition Temperature (Tg): ≥ 90°C

• Shore D Hardness: 80

• Particle Size: 99% ≤ 20 Microns

• Suggested Operating Temperature:

  • Up to 325°C Intermittent

  • Up to 617°F Intermittent

Coefficient of Thermal Expansion (CTE)

• Below Tg: 43 × 10⁻⁶ in/in/°C

• Above Tg: 231 × 10⁻⁶ in/in/°C

Handling and Processing

• Working Life (Pot Life): Up to 3 Hours

• Recommended Cure Schedule: 150°C (302°F) for 1 Hour

Typical Applications

Fiber Optic Applications

• Fiber optic component assembly

• Optical packaging

• Fiber ferrule bonding

• Optical alignment assemblies

• Optoelectronic device packaging

• Environmental sealing of optical components

Electronics and Hybrid Applications

• Circuit assembly

• Hybrid microelectronics

• Sensor packaging

• Electronic component bonding

• High-temperature electronic assemblies

Medical and Industrial Applications

• Medical device assembly

• Precision instrumentation

• Industrial sensor systems

• High-reliability structural bonding

Why Choose EPO-TEK® 353NDT?

EPO-TEK® 353NDT combines the proven performance of EPO-TEK® 353ND with a highly thixotropic, non-flowing formulation that enables precise adhesive placement without sagging or migration. It is an excellent choice for applications requiring high-temperature resistance, reliable bonding, and controlled dispensing characteristics.

Storage and Shelf Life

Store refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.