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EPO-TEK® 383ND High Temperature Epoxy, Heat Cure (4g)

Part No.: ET383ND-4G

  • $ 15.95


EPO-TEK® 383ND High Temperature Optical Epoxy, Heat Cure (4g Packet)

EPO-TEK® 383ND is a high-performance, two-part heat-cure epoxy designed for demanding fiber optic, photonics, semiconductor, and electronic assembly applications. Developed as an extended working life alternative to EPO-TEK® 353ND, it combines excellent thermal stability, optical transmission, and long-term reliability with an extended pot life of up to 8 hours.

Its low-viscosity formulation promotes excellent wicking and capillary action, making it ideal for optical assemblies, ferrule bonding, fiber optic packaging, and precision optical alignment. EPO-TEK 383ND also provides exceptional transmission across visible and near-infrared wavelengths, making it well suited for optical pathways and photonic device packaging.

Supplied in a convenient 4-gram packet for accurate mixing and reduced waste.

Features and Benefits

Extended 8-Hour Working Life

Provides significantly more assembly time than standard optical epoxies, making it ideal for complex assemblies, batch processing, and precision alignment applications.

Excellent Optical Transmission

Delivers greater than 90% transmission across a broad wavelength range from 520 nm to 1660 nm.

Low Viscosity for Wicking and Capillary Action

Flows easily into ferrules, optical assemblies, and narrow gaps where controlled capillary penetration is required.

High Temperature Performance

Maintains excellent mechanical strength and thermal stability in demanding environments.

Visual Cure Verification

Changes from clear to dark amber when fully cured, allowing quick visual confirmation of proper curing.

Electrically and Thermally Insulating

Suitable for electronic packaging, dielectric applications, and electrical insulation requirements.

Designed for Fiber Optic Applications

Developed to meet Telcordia GR-1221 requirements for fiber optic component assembly and packaging.

Technical Specifications

  • Product Type: Two-Part Heat Cure Optical Epoxy

  • Package Size: 4 g Packet

  • Consistency: Pourable Liquid

Color Before Cure

  • Part A: Clear

  • Part B: Slightly Yellow

Physical Properties

  • Viscosity at 23°C: 3,500 to 6,000 cPs

  • Glass Transition Temperature (Tg): ≥ 100°C

  • Shore D Hardness: 88

  • Particle Size: ≤ 20 Microns

  • Suggested Operating Temperature:

    • Up to 350°C Intermittent

    • Up to 662°F Intermittent

Coefficient of Thermal Expansion (CTE)

  • Below Tg: 34 × 10⁻⁶ in/in/°C

  • Above Tg: 129 × 10⁻⁶ in/in/°C

Optical Properties

Spectral Transmission

  • Greater than 90% from 520 nm to 1660 nm

Refractive Index

  • 1.5715 at 589 nm (Uncured)

Handling and Processing

  • Working Life (Pot Life): Up to 8 Hours

  • Recommended Centrifuge Cycle: 5 to 10 Minutes at 1,000 RPM

  • Recommended Cure Schedule: 150°C (302°F) for 1 Hour

Typical Applications

Fiber Optic and Photonics Applications

  • Fiber ferrule bonding

  • Fiber optic connector assembly

  • Optical component packaging

  • Active optical alignment

  • V-groove array assembly

  • Environmental sealing of optoelectronic packages

  • Fiber optic bundle potting

  • Endoscope light guide assembly

  • Optical sensor packaging

Semiconductor Applications

  • Wafer-to-wafer bonding

  • Chip scale package (CSP) assembly

  • MEMS fabrication

  • Flip-chip underfill

Electronics Applications

  • Capacitor fabrication

  • Dielectric layer formation

  • PZT piezoelectric lamination

  • Inkjet device assembly

  • Electronic packaging

Precision Industrial Applications

  • Structural bonding

  • Hard disk drive assembly

  • Voice coil sealing

  • Anti-disk sealing

  • High-reliability industrial assemblies

Why Choose EPO-TEK 383ND?

EPO-TEK 383ND offers the proven reliability of EPO-TEK 353ND while providing a significantly longer 8-hour pot life. Its combination of excellent optical transmission, low viscosity, and high-temperature performance makes it an ideal choice for fiber optic manufacturing, optical packaging, semiconductor assembly, and precision photonics applications.

Storage and Shelf Life

Store refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.

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