EPO-TEK® 383ND High Temperature Epoxy, Heat Cure (4g)
EPO-TEK® 383ND High Temperature Optical Epoxy, Heat Cure (4g Packet)
EPO-TEK® 383ND is a high-performance, two-part heat-cure epoxy designed for demanding fiber optic, photonics, semiconductor, and electronic assembly applications. Developed as an extended working life alternative to EPO-TEK® 353ND, it combines excellent thermal stability, optical transmission, and long-term reliability with an extended pot life of up to 8 hours.
Its low-viscosity formulation promotes excellent wicking and capillary action, making it ideal for optical assemblies, ferrule bonding, fiber optic packaging, and precision optical alignment. EPO-TEK 383ND also provides exceptional transmission across visible and near-infrared wavelengths, making it well suited for optical pathways and photonic device packaging.
Supplied in a convenient 4-gram packet for accurate mixing and reduced waste.
Features and Benefits
Extended 8-Hour Working Life
Provides significantly more assembly time than standard optical epoxies, making it ideal for complex assemblies, batch processing, and precision alignment applications.
Excellent Optical Transmission
Delivers greater than 90% transmission across a broad wavelength range from 520 nm to 1660 nm.
Low Viscosity for Wicking and Capillary Action
Flows easily into ferrules, optical assemblies, and narrow gaps where controlled capillary penetration is required.
High Temperature Performance
Maintains excellent mechanical strength and thermal stability in demanding environments.
Visual Cure Verification
Changes from clear to dark amber when fully cured, allowing quick visual confirmation of proper curing.
Electrically and Thermally Insulating
Suitable for electronic packaging, dielectric applications, and electrical insulation requirements.
Designed for Fiber Optic Applications
Developed to meet Telcordia GR-1221 requirements for fiber optic component assembly and packaging.
Technical Specifications
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Product Type: Two-Part Heat Cure Optical Epoxy
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Package Size: 4 g Packet
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Consistency: Pourable Liquid
Color Before Cure
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Part A: Clear
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Part B: Slightly Yellow
Physical Properties
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Viscosity at 23°C: 3,500 to 6,000 cPs
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Glass Transition Temperature (Tg): ≥ 100°C
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Shore D Hardness: 88
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Particle Size: ≤ 20 Microns
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Suggested Operating Temperature:
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Up to 350°C Intermittent
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Up to 662°F Intermittent
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Coefficient of Thermal Expansion (CTE)
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Below Tg: 34 × 10⁻⁶ in/in/°C
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Above Tg: 129 × 10⁻⁶ in/in/°C
Optical Properties
Spectral Transmission
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Greater than 90% from 520 nm to 1660 nm
Refractive Index
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1.5715 at 589 nm (Uncured)
Handling and Processing
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Working Life (Pot Life): Up to 8 Hours
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Recommended Centrifuge Cycle: 5 to 10 Minutes at 1,000 RPM
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Recommended Cure Schedule: 150°C (302°F) for 1 Hour
Typical Applications
Fiber Optic and Photonics Applications
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Fiber ferrule bonding
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Fiber optic connector assembly
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Optical component packaging
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Active optical alignment
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V-groove array assembly
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Environmental sealing of optoelectronic packages
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Fiber optic bundle potting
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Endoscope light guide assembly
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Optical sensor packaging
Semiconductor Applications
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Wafer-to-wafer bonding
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Chip scale package (CSP) assembly
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MEMS fabrication
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Flip-chip underfill
Electronics Applications
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Capacitor fabrication
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Dielectric layer formation
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PZT piezoelectric lamination
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Inkjet device assembly
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Electronic packaging
Precision Industrial Applications
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Structural bonding
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Hard disk drive assembly
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Voice coil sealing
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Anti-disk sealing
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High-reliability industrial assemblies
Why Choose EPO-TEK 383ND?
EPO-TEK 383ND offers the proven reliability of EPO-TEK 353ND while providing a significantly longer 8-hour pot life. Its combination of excellent optical transmission, low viscosity, and high-temperature performance makes it an ideal choice for fiber optic manufacturing, optical packaging, semiconductor assembly, and precision photonics applications.
Storage and Shelf Life
Store refrigerated according to the manufacturer's recommendations to maximize shelf life and maintain optimum performance.