EPO-TEK® OG198-54 Electrically and Thermally Insulating Epoxy, UV & Heat Cure, 3cc Automatic Cartridge

EPO-TEK® OG198-54 is a single-component, low-viscosity epoxy adhesive designed for optical, fiber optic, photonic, electronic, and medical device applications requiring exceptional optical clarity, electrical insulation, and thermal stability. This UV and heat-curable epoxy combines rapid UV curing with secondary thermal cure capability, ensuring complete polymerization even in shadowed areas where UV light cannot penetrate.

With excellent transmission across the visible and near-infrared spectrum, OG198-54 is ideal for optical bonding, photonic packaging, fiber optic assembly, and sensor applications. The low-viscosity formulation promotes excellent wetting and capillary flow, making it suitable for precision dispensing and automated manufacturing processes.

The high glass transition temperature and outstanding electrical and thermal insulating properties make this epoxy an excellent choice for demanding environments requiring long-term reliability.

FOSCO Shelf Life Guarantee: Minimum 3 Months Remaining Shelf Life at Time of Shipment

Note: Dry ice shipment is not required when the application is not viscosity sensitive.

Features & Benefits

• Single-component UV and heat-cure epoxy

• UV shadow-cure capability for complete curing in shaded areas

• Electrically insulating formulation

• Thermally insulating properties

• Excellent optical clarity and light transmission

• Low viscosity for precision dispensing and capillary flow

• High glass transition temperature for thermal stability

• Ideal for optical, photonic, and fiber optic applications

• Supplied in a 3cc automatic dispensing cartridge

Typical Applications

• Fiber optic component assembly

• Optical bonding

• Photonic device packaging

• Lens and sensor attachment

• Optoelectronic assembly

• Medical device manufacturing

• Electronic packaging

• Precision optical alignment

• Semiconductor and sensor packaging

Technical Specifications

Optical Properties

Advantages of UV Shadow Cure Technology

OG198-54 rapidly cures when exposed to UV light while also supporting a thermal post-cure for areas inaccessible to UV radiation. This dual-cure mechanism improves assembly reliability by ensuring complete curing throughout the bond line, even in complex optical and electronic assemblies.

Markets Served

• Fiber Optics

• Photonics

• Optoelectronics

• Medical Devices

• Semiconductor Manufacturing

• Sensor Manufacturing

• Electronic Packaging

• Optical Instrumentation