FS-N5850-48X6C, Bare Metal Switch, 48-Port Ethernet Data Center, 48 x 10G RJ-45, with 6 x 100Gb QSFP28 Uplinks, Broadcom Trident 3-X5 Chip
FS-N5850-48X6C, Bare Metal Switch, 48-Port Ethernet Data Center, 48 x 10G RJ-45, with 6 x 100Gb QSFP28 Uplinks, Broadcom Trident 3-X5 Chip
FS-N5850-48X6C is a leaf switch for data centers, it provides line-rate L2 and L3 switching across the 48x 10Gb RJ-45 downlink and 6x 100GbE FS-QSFP28 uplink port in a compact 1U form factor. It is optimally deployed as a leaf switch supporting 10/40/100GbE leaf interconnects.
The switch is loaded with the Open Network Install Environment (ONIE), which supports the installation of compatible Network Operating System software, including the commercial PicOS® offerings.
Specifications
- Ports: 48x 10G RJ-45 | 6x 100G QSFP28
- Switching Capacity: 1.08 Tbps
- Switch Chip: Broadcom BCM56771 Trident 3
- Forwarding Rate: 964.28 Mpps
- CPU: Intel Atom® C3558 2.2GHz 4-Core x86 processor
- Packet Buffer: 32MB integrated packet buffer
- Power Supplies: 2 (1+1 Redundancy) Hot-swappable, AC
- Jumbo Frame: 9K bytes
- Fans: 5x Hot-swappable Fans, Front-Rear
- DRAM: 2x 8 GB SO-DIMM
- Dimensions (HxWxD): 1.73"x17.42"x18.63" (43.95x442.5x473.3mm)
- Flash Memory: 64GB
- Weight: 21.14 lbs (9.59kg)
- SPI Flash: 16 MB x2
- Operating Temperature: 32°F to 104°F (0°C to 40°C)
- Input Voltage: 100-240VAC, 50-60Hz
- Storage Temperature: 40°F to 158°F (-40°C to 70°C)
- Max. Power Consumption: 323W
- Operating Humidity: 5% to 95% (Non-condensing)
- Rack Unit: 1U
- Weight: 21.14 lbs (9.59kg)
- Switch Chip: Broadcom BCM56771 Trident 3-X5
- Ports: 48x 10G RJ-45 | 6x 100G QSFP28
- Switching Capacity: 1.08 Tbps
- Forwarding Rate: 964.28 Mpps
- Power Supplies: 2 (1+1 Redundancy) Hot-swappable, AC
- Fans: 5x Hot-swappable Fans, Front-Rear
- Max. Power Consumption: 323W
Connectivity Solutions
High-speed and Flexible Interface Enhance Network Performance
10G for servers and 100G uplinks for spine switches provide high-speed, low-latency networks, with the low-power design optimizing energy usage and reducing heat dissipation.
FS-BCM56771 Trident 3 Delivers a Glueless Network Connectivity
The FS-BCM56771 is a high-capacity device, which delivers high-bandwidth, glueless network connectivity of up to 1.08 Tb/s on a single chip along with the new 10GbE and 100GbE IEEE standards.
Hardware-level Redundancy Ensures Network Stability
Hot-swappable redundant power supplies and fans ensure high reliability and intelligent, efficient heat dissipation to support the development of low-carbon data centers.
PicOS® Ensures Network Performance and Streamlines Management
The switch provides comprehensive L2/L3 capabilities when equipped with PicOS® software while enhancing availability, security, and management, thereby improving network performance and simplifying operations.
AmpCon-DC Automated Configuration and Unified Management
After being equipped with PicOS® software, the switch can be managed by the AmpCon-DC management platform to provision, monitor, proactively troubleshoot, and maintain high-performance networking, enabling higher resource utilization and lower OPEX.