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FS-N5850-48X6C, Bare Metal Switch, 48-Port Ethernet Data Center, 48 x 10G RJ-45, with 6 x 100Gb QSFP28 Uplinks, Broadcom Trident 3-X5 Chip

Fosco Connect Part No.: FS-N5850-48X6C

  • $ 9,455.00 or



FS-N5850-48X6C, Bare Metal Switch, 48-Port Ethernet Data Center, 48 x 10G RJ-45, with 6 x 100Gb QSFP28 Uplinks, Broadcom Trident 3-X5 Chip

FS-N5850-48X6C is a leaf switch for data centers, it provides line-rate L2 and L3 switching across the 48x 10Gb RJ-45 downlink and 6x 100GbE FS-QSFP28 uplink port in a compact 1U form factor. It is optimally deployed as a leaf switch supporting 10/40/100GbE leaf interconnects.


The switch is loaded with the Open Network Install Environment (ONIE), which supports the installation of compatible Network Operating System software, including the commercial PicOS® offerings.

Specifications

  • Ports: 48x 10G RJ-45 | 6x 100G QSFP28
  • Switching Capacity: 1.08 Tbps
  • Switch Chip: Broadcom BCM56771 Trident 3
  • Forwarding Rate: 964.28 Mpps
  • CPU: Intel Atom® C3558 2.2GHz 4-Core x86 processor
  • Packet Buffer: 32MB integrated packet buffer
  • Power Supplies: 2 (1+1 Redundancy) Hot-swappable, AC
  • Jumbo Frame: 9K bytes
  • Fans: 5x Hot-swappable Fans, Front-Rear
  • DRAM: 2x 8 GB SO-DIMM
  • Dimensions (HxWxD): 1.73"x17.42"x18.63" (43.95x442.5x473.3mm)
  • Flash Memory: 64GB
  • Weight: 21.14 lbs (9.59kg)
  • SPI Flash: 16 MB x2
  • Operating Temperature: 32°F to 104°F (0°C to 40°C)
  • Input Voltage: 100-240VAC, 50-60Hz
  • Storage Temperature: 40°F to 158°F (-40°C to 70°C)
  • Max. Power Consumption: 323W
  • Operating Humidity: 5% to 95% (Non-condensing)
  • Rack Unit: 1U
  • Weight: 21.14 lbs (9.59kg)
  • Switch Chip: Broadcom BCM56771 Trident 3-X5
  • Ports: 48x 10G RJ-45 | 6x 100G QSFP28
  • Switching Capacity: 1.08 Tbps
  • Forwarding Rate: 964.28 Mpps
  • Power Supplies: 2 (1+1 Redundancy) Hot-swappable, AC
  • Fans: 5x Hot-swappable Fans, Front-Rear
  • Max. Power Consumption: 323W

Connectivity Solutions

 

High-speed and Flexible Interface Enhance Network Performance
10G for servers and 100G uplinks for spine switches provide high-speed, low-latency networks, with the low-power design optimizing energy usage and reducing heat dissipation.

 

FS-BCM56771 Trident 3 Delivers a Glueless Network Connectivity
The FS-BCM56771 is a high-capacity device, which delivers high-bandwidth, glueless network connectivity of up to 1.08 Tb/s on a single chip along with the new 10GbE and 100GbE IEEE standards.

 

Hardware-level Redundancy Ensures Network Stability
Hot-swappable redundant power supplies and fans ensure high reliability and intelligent, efficient heat dissipation to support the development of low-carbon data centers.

 

 

PicOS® Ensures Network Performance and Streamlines Management
The switch provides comprehensive L2/L3 capabilities when equipped with PicOS® software while enhancing availability, security, and management, thereby improving network performance and simplifying operations.

 

AmpCon-DC Automated Configuration and Unified Management
After being equipped with PicOS® software, the switch can be managed by the AmpCon-DC management platform to provision, monitor, proactively troubleshoot, and maintain high-performance networking, enabling higher resource utilization and lower OPEX.

 

 

 

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