FS-S5870-48MX6BC-U, 48-Port Ethernet L3 PoE++ Bare Metal Switch, 36 x 2.5Gb PoE++ Ports, 12 x 10Gb PoE++ Ports @2100W, with 4 x 25Gb SFP28 and 2 x 100Gb FS-QSFP28 Uplinks, Redundant AC PSUs, C2P Airflow, Support MLAG, Broadcom TD3-X3 Chip

FS-S5870-48MX6BC-U is a next-generation L3 switch with 36x 100M/1000M/2.5G ports, 12x 1G/2.5G/5G/10GBASE-T ports, 4x 25G SFP28 uplinks and 2x 100G QSFP28 ports.

It supports IEEE 802.3at and 802.3bt and is well-suited for enterprise campus, hospitality, warehouse, and retail applications, facilitating seamless interconnection of Wi-Fi 6E/Wi-Fi 7 access points, VoIP phones, IP cameras, security systems, and sensors.

The switch is loaded with the Open Network Install Environment (ONIE), which supports the installation of compatible Network Operating System software, such as commercial PicOS® offerings.

Specifications

• Ports: 36x 1/2.5G Multigig | 12x 1/2.5/5/10G Multigig | 4x 25G SFP28 | 2x 100G QSFP28
  
• Switching Capacity: 510 Gbps (unidirectional)/1020 Gbps (bidirectional)
  
• Switch Chip: BCM56370 Trident3-X3
  
• Forwarding Rate: 863.1 Mpps
  
• CPU: Intel Atom/Denverton C3558 4-cores 2.2 GHz
  
• Packet Buffer: 8MB
  
• Power Supplies: 2 (1+1 Redundancy) Hot-swappable
  
• Jumbo Frame: 12,288
  
• Fans: 3 (2+1 Redundancy) Built-in
  
• DDR4: 8 GB x 2 SO-DIMM
  
• Dimensions (HxWxD): 1.73"x17.24"x18.66" (44x438x474mm)
  
• Flash Memory: m.2 SSD: 32 GB MLC
  
• Weight: 8.5 kg (18.74 lb)
  
• SPI Flash: 16 MB x 2
  
• Operating Temperature: 0 to 45°C (32 to 113°F)
  
• Input Voltage: 100-240VAC, 50-60Hz
  
• Storage Temperature: -40 to 70°C (-40 to 158°F)
  
• Max. Power Consumption: 2400W
  
• Operating Humidity: 5% to 95% (Non-condensing)
  
• Rack Unit: 1 RU
• Weight: 8.5 kg (18.74 lb)
• Switch Chip: BCM56370 Trident3-X3
• Ports: 36x 2.5G RJ45; 12x 2.5/5/10G RJ45; 4x 25G SFP28; 2x 100G QSFP28

Product Highlights

• Broadcom BCM56370 Trident3-X3 Chip, 1.02 Tbps Throughout
  
• 2.5G/10G PoE++ for Wi-Fi 7 Access, 25G/100G Uplink
  
• 1+1 Hot-swappable Power Supplies, 2+1 Hot-swappable Smart Fans
  
• Support PicOS® Network Operating System
  
• AmpCon-Campus Management Platform Provides Full Day 0 to Day 2+ Capabilities
• Switching Capacity: 510 Gbps (unidirectional)/1020 Gbps (bidirectional)
• Forwarding Rate: 863.1 Mpps
• Power Supplies: 2 (1+1 Redundancy) Hot-swappable, AC
  
• Fans: 3 (2+1 Redundancy) Built-in, Front-to-Back
• Max. Power consumption: 2400W
• Power Budget: 2100W

Wi-Fi 7 Campus Network

Flexible and Dense Ports with 2.5G/10G/25G/100G for Versatile Networking
Provide large-scale device access and Wi-Fi 7 applications through 2.5G/10G ports, and can be connected to uplink devices through high-performance 25G/100G ports, fully meeting users' requirements for high-density access and high-performance aggregation.

BCM56370 Trident3-X3 Delivers a Glueless Network Connectivity
The BCM56370 is a high-capacity device, which delivers high-bandwidth, glueless network connectivity of up to 1.02 Tb/s on a single chip.

Dual Redundant Power Supplies and Fans
Ship with dual power supplies and fans by default, provide high availability and longevity.

PicOS® Ensures Network Performance and Streamlines Management
The switch provides comprehensive L2/L3 capabilities when equipped with PicOS® software while enhancing availability, security, and management, thereby improving network performance and simplifying operations.

AmpCon-Campus Automated Configuration and Unified Management
After being equipped with PicOS® software, the switch can be managed by the AmpCon-Campus Management Platform to provision, monitor, proactively troubleshoot, and maintain high-performance networking, enabling higher resource utilization and lower OPEX.