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THFWAV1 - Tungsten Filament Assembly, ≤Ø200 µm Cladding
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THFWAV1 - Tungsten Filament Assembly, ≤Ø200 µm Cladding

THFWAV1 - Tungsten Filament Assembly, ≤Ø200 µm Cladding

Fosco ConnectSKU: THFWAV1
Price:
$ 1,215.00
Silicon Valley Based
Expert Support Since 2001
Fast CA or NY Shipping

THFWAV1 - Tungsten Filament Assembly, ≤Ø200 µm Cladding

  • Filament Assemblies for CO2 Laser Glass Processor (One THFTAV4 Graphite Filament Included with Each System)
  • Optimized for Splicing, Tapering, or Lensed Tip Applications (See Table to the Right for Details)
  • Assembly Includes Filament Element and Protective Shroud
  • Filament Material Tungsten 
  • Cladding Diameter (Min/Max) ≤200 µm
  • Application Splice

Product Drawing

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